Wi2Wi Inc.'s new System in Package (SiP) product solutions allow developers to take advantage of complete radio system solutions in much smaller form factors and lower cost than traditional module designs. Utilizing proven IC Packaging Technologies, Wi2Wi, Inc. has developed complete radio and combo-radio solutions in scales typically reserved for ICs only.

The rapid adoption of wireless connectivity in the portable/personal electronics market has driven solution providers to deliver ever-smaller, more cost effective solutions to product developers. And with product development cycles coming under considerable pressure to accelerate the complexities of integrating multiple radios into a single product have greater technical and financial risk. Already a market leader in traditional wireless modules, Wi2Wi has developed for the OEM market a new line of System in Package (SiP) solutions to solve these challenges.

Typically, modules have been designed to incorporate the core functionality of a radio, but not a complete radio solution. As a result, the developer usually finds themselves developing the actual radio system to integrate those functions normally omitted. This lengthens the time-to-market and time-to-revenue aspects of a product development program.

Designed using the industry's best in class silicon technologies, Wi2Wi's products address the Wi-Fi™, Bluetooth™, and GPS market demand for smaller, more effective solutions. Wi2Wi's SiP products attack these issues head-on by delivering a complete radio solution in scales normally associated only with ceramic solutions. Our products deliver world-class functionality including all I/O, power management/regulation, clock, front-end components and firmware. All the developer needs to do is connect the interfaces and antenna port(s) and load the drivers to have an optimized, fully functional digital radio. This allows the developer to focus their development efforts on the product and applications, where their greatest value lies.

Wi2Wi's SiP Technology also solves many of the typical manufacturing and supply chain issues normally associated with both board down and module solutions. Designed to support standard Surface Mount Technology (SMT) processes, our SiP products do not require special handling, reflow or rework processes. As a result, our customers no longer need to integrate connectors or develop and maintain unique manufacturing techniques to support a module design-in. And because our SiP solutions come in tape and reel pre-tested from the factory, our customers' test and QA burdens are minimized.

For product developers who are seeking to integrate Wireless connectivity into their products, there is no better solution that Wi2Wi's Radio SiP Products.

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