WiFi 802.11 bgn Module 2.4G with integrated chip antenna & u.Fl connector
WM825B00

Overview

WM825B00 from Wi2Wi's Maximum Performance series is a 1x1 SISO, Single-Band Hosted Wi-Fi module. This module is integrated with a chip antenna and an u.Fl connector and supports antenna diversity. It is a highly integrated Wireless LAN (WLAN) subsystem with MAC, baseband, RF front-end, PA, crystal, switch, filter and OTP memory for calibration data and MAC address storage. This 802.11 bgn module offers SDIO 2.0 and USB 2.0 host interfaces for easy connection to all leading 32 bit processors running Linux operating systems. This ultra-small wifi module, WM825B00 gives Industry's Best in class performance for high throughput (HT), high transmit power (TXPWR), excellent receive sensitivity (RSSI) and supports deep sleep and standby modes for low power operation. The highly integrated WM825B00 provides all necessary circuitry for a complete 2.4 GHz, IEEE 802.11 b/g/n wi-fi connectivity solutions requiring no other external components other than power supply. WM825B00 is FCC, CE and IC certified and comes in various operating temperatures.




Single-Band Hosted Wi-Fi module



Features

  • Small size WLAN module with footprint: 12.5 mm x 16 mm x 1.76 mm
  • IEEE 802.11b/g/n Single-Band Wi-Fi, 1x1 SISO
  • 20 MHz Channel Bandwidth
  • High Throughput (HT) up to 50 Mbps
  • Support for Station/Client Mode, Access Point Mode, and Wi-Fi Direct Mode
  • Onboard Chip Antenna + U.FL Connector
  • Support for Antenna Diversity
  • Maximum Wi-Fi transmit (Tx) power is ~ 18 dBm
  • Best Wi-Fi Receiver (Rx) sensitivity is -97 dBm
  • Single power supply operation, 3.3V DC
  • Drivers available for Linux
  • Support for SDIO and USB host interfaces
  • RF Calibration Data and MAC addresses are stored in onboard OTP memory
  • Optimized RF and electrical design for excellent performance
  • Global certifications: FCC, IC, CE
  • Available in industrial (-40℃ to +85℃), extended (-30℃ to +85℃) and commercial (0℃ to +70℃) operating temperature variants




Block Diagram
Single-Band Hosted Wi-Fi module

Certifications
  • FCC
  • IC
  • CE
Applications
  • IoT (Internet of Things)
  • IIoT (Industrial IoT) / M2M (Machine-to-Machine)
  • Imaging platforms (printer, digital camera)
  • Internet enabled consumer devices
  • Video streaming (DTV, DVD/Blu-ray players)
  • Video conferencing, Vo-Fi (Voice over Wi-Fi)
  • Wi-Fi enabled security cameras
  • Home audio/video system
  • Automotive aftermarket
  • Warehousing and logistics handhelds
  • Medical imaging and monitoring equipment
  • Gaming platforms
  • Mobile routers (Mi-Fi)
  • Smart homes
  • Smart energy



Specifications

Wi-Fi IEEE 802.11: b/g/n, Single-Band (2.4GHz)
Available Channels: Channels 1-13
Channel Bandwidth: 20 MHz
802.11b Data Rates: DSSS Modulation: 1 and 2 Mbps
CCK Modulation: 5.5 and 11 Mbps
802.11g Data Rates: OFDM Modulation: 6, 9, 12, 18, 24, 36, 48 and 54 Mbps
802.11n Data Rates: MCS0-MCS7 (up to 72.2 Mbps)
Other 802.11 Features: 802.11d/e/h/i/k/r/w
Maximum Transmit Power: 18 dBm
Receive Sensitivity: -97 dBm (PER < 8%)



Kits

Evaluation Kit

Single-Band Hosted Wi-Fi module Evaluation kit

Part Ordering: WM825B00-EVK3
The WM825B00 Evaluation kit is a single-band Wi-Fi evaluation platform for the WM825B00 802.11b/g/n WLAN module. This WM825B00 wireless LAN module along with other supporting passive components is mounted on the Evaluation board which is designed as SD card adapter to directly insert into various Microprocessor development platforms or Laptops without any extra connectors. This board is designed to evaluate both SDIO and USB host interfaces. It was used for performing FCC, CE and IC certification and the same Wi-Fi evaluation board can be used to perform the RF tests for any regional certifications like TELEC, KCC, Anatel, etc. The Kit comes with Single-Band (2.4GHz) IEEE 802.11 b/g/n Wi-Fi module Evaluation Board, a Micro USB to USB cable and a 2.4 GHz Rubber Duck Antenna with u.Fl connector cable. A complete software driver support for Linux and all related collaterals will help the user to evaluate this hosted Wi-Fi module and integrate into their end system with substantial reduction in their RND efforts, resources, budget and supports faster time to market.

Development Kit

Single-Band Hosted Wi-Fi module development kit

Part Ordering: WM825B00-DVK3
The WM825B00 Development kit (WM825B00-DVK3) is a plug and play system. It enables customer to evaluate, integrate and develop software for their end system. The Kit comes with WM825B00 Evaluation board, i.MX6 development platform, all necessary accessories and tools. The related collateral explains one click demo program and other sample programs which customer can leverage to their end applications.



Drivers & Documentation

Particulars File Version Size Last Updated
Product Brief WM825B00_Product_Brief.pdf 1.0 607 KB 12/14/2016
Data Sheet WM825B00_Datasheet.pdf 0.6 1.5 MB 12/14/2016
Evaluation Kit Flyer WM825B00-EVK3_Flyer.pdf 1.0 717 KB 12/14/2016
Software User Guide WM825B00_Software_UserGuide.pdf 0.02 1.26 MB 12/14/2016
Hardware Integration Guide WM825B00_Hardware_Integration_Guide.pdf 0.01 1.43 MB 12/14/2016
Drivers WM825B00.LNX.PROD.1.0.0.zip 1.0.0 2.85 MB 12/14/2016



Ordering

Part Order Number Description Antenna Operating Temperature Packaging Type Buy from Distributor
WM825B00-I3QT Module Chip + u.Fl (-40°C to +85°C) Tray Buy Now
WM825B00-E3QT Module Chip + u.Fl (-30°C to +85°C) Tray Buy Now
WM825B00-C3QT Module Chip + u.Fl (0°C to +70°C) Tray Buy Now
WM825B00-I3QR Module Chip + u.Fl (-40°C to +85°C) Reel Buy Now
WM825B00-E3QR Module Chip + u.Fl (-30°C to +85°C) Reel Buy Now
WM825B00-C3QR Module Chip + u.Fl (0°C to +70°C) Reel Buy Now
WM825B00-EVK3 WM825B00-I3 Module on Evaluation Kit Chip + u.Fl + Rubber Duck with u.Fl connector cable (-40°C to +85°C) Kit Buy Now
WM825B00-DVK3 WM825B00-EVK3 and i.MX6 Development Platform with all needed Software for application development Chip + u.Fl + Rubber Duck with u.Fl connector cable (-40°C to +85°C) Kit Buy Now